Presentation & Publication Highlights
Recognition: Certificates for Best Oral and Best Poster presentations will be awarded to outstanding contributors.
Scopus Indexed Publication: Presented papers, following a thorough peer-review process, will be eligible for publication in prestigious Scopus-indexed journals.
Journal of Electronic Materials (I.F. 2.5 Springer)*
https://link.springer.com/journal/11664
Publication Opportunity
We are pleased to inform participants that selected papers presented at the National Conference on Emerging Trends in Multifunctional Materials and Devices (NC-ETMMD-2026) will be considered for publication in a Topical Collection of the Journal of Electronic Materials (JEM), Springer Nature.
Manuscript Submission
The due date for manuscript submission is 31 May 2026.
Manuscripts must be submitted through the online submission system:
Submission Portal:
http://www.editorialmanager.com/jems/default.aspx
During submission, authors must select the article type “S.I.: NC-ETMMD-2026” from the dropdown menu.
All manuscripts will be evaluated according to the same high standards applied to all articles published in the Journal of Electronic Materials. Authors are requested to carefully follow the Instructions for Authors available on the journal website.
Please note:
Papers already published in conference proceedings will not be considered for review.
All submissions will undergo a plagiarism screening to evaluate overlap with previously published work.
Manuscripts submitted after the deadline may not be considered for the topical collection, though they may still be evaluated as regular submissions at the discretion of the editors.
Scope of the Special Issue
Manuscripts should fall within the scope of the conference themes, including:
Electronic, optoelectronic, and photonic materials
Semiconductor materials and devices
Functional oxides, chalcogenides, and low-dimensional materials
Materials for energy harvesting, storage, and conversion
Materials for quantum, spintronic, and neuromorphic devices
Thin films, heterostructures, interfaces, and device fabrication
Reliability, degradation, and performance of electronic materials
Submit at www.editorialmanager.com/jems
Author instructions and additional journal details available at www.springer.com/11664
Guest Editors
Lead Guest Editor
Dr. Arvind Kumar
Assistant Professor, School of Physical Sciences
Jawaharlal Nehru University, New Delhi – 110067, India
Email: arvind@jnu.ac.in
Guest Editors
Dr. Manish Kumar
Associate Professor, Department of Physics
ARSD College, University of Delhi, New Delhi, India
Dr. Chandra Shekhar
PI & Group Leader (Permanent Position)
Max Planck Institute for Chemical Physics of Solids
Nöthnitzer Str. 40, 01187 Dresden, Germany
Contact
For any queries regarding the submission or the special issue, authors may contact:
Prof. Wojciech M. Jadwisienczak – Editor-in-Chief, Journal of Electronic Materials
Dr. Nicholas Millington – Managing Editor
Jamie Buonato – Managing Editor
Dr. Arvind Kumar – Lead Guest Editor (NC-ETMMD-2026)
